Silicone-based Chip-in-Foil System

Silicone-based Chip-in-Foil System

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Aiming at devices for bioelectronic medicine, this paper proposes a die embedding process for the fabrication of flexible smart implants.By combining thinned bare dies with a polymeric encapsulation, completely cardinals 3.14 flash sale flexible implants can be designed.The dies are encapsulated using a flip-chip process and a backfilling with silicone rubber.A completely even surface without detectable edge between the chip and the surrounding polymer substrate is achieved by gluing the chips face-down onto a polyimide-covered substrate.

The backside is coated with silicone rubber and a second copyright substrate is attached.Removing the first substrate subsequent to curing of the silicone leads to chips located under a continuous polyimide layer, enabling the use of microtechnology for further processing steps.A custom-made test chip is essie blush worthy proposed that enables the evaluation of the mechanical and chemical stability of the system.